Samsung Decan S1 SMT Equipment 0.05mm Ultra-Fine Pitch Auto Feeder & Vision System PCB Board Assembly Pick and Place Chip Mounter For SMT Assembling Line Production

Product description

DECAN S1 pick and place machine Features:
High PCB handling capacity in a medium speed bonder
510 x 510mm (standard) / 1500 x 460mm (option) - PCBs of 1,500mm(L) x 460mm(W) size can be produced

High Reliability
Stable mounting of microchips
Automatic calibration is performed during production to maintain consistent placement accuracy

Productivity
Best performance in its class
Expanding the range of component recognition by camera high pixelation, increasing the simultaneous pick-up rate and speed of shaped component placement

Easy Operation
Enhanced ease of use
Easy and shortened calibration time for large odd-shaped components Maintains Chip component lighting level unification function and common feeder pickup coordinates

Product specification

Product details

Applications:

Widely used in electronics manufacturing, consumer electronics, automobile electronics, communications equipment, aerospace, medical equipment, LED lamps, computers and peripherals, smart home, smart logistics, miniature and high power ratio electronic devices.

Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, production, and customization of full-line SMT equipment, supported by installation, software training, and exceptional after-sales service. Our commitment to innovation, quality, and customer satisfaction has made us a trusted partner for businesses worldwide.

We offer a complete range of SMT machines and solutions, including: SMT Pick and Place Machines, Solder Paste Printers, Reflow Oven Machines, 3D AOI (Automated Optical Inspection) Machines, 3D SPI (Solder Paste Inspection) Machines, Wave Soldering Machines, DIP Insertion Lines, THT Component Insertion Machine, UV Conformal Coating Machine, PCB Glue Dipensing Machine, UV Curing Furance Machine, BGA (Ball Grid Array) Machines, SMT Loader and Unloader Machines, Customized OEM and ODM Equipment.