Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder Die Bonding Machine

Strip Die Bonder-Dual Dispensing

Machine Features
● Front-loading and rear-loading methods, compatible with a docking station, facilitate operator operation and connection, improving production cycle time;
● Utilizes internationally leading dual die bonding, dual dispensing, and dual wafer search systems;
● Utilizes a direct-drive motor to drive the bonding head;
● Utilizes a linear motor to drive the wafer search platform (X/Y) and feed platform (B/C);
● Utilizes an automatic angle correction system for the wafer frame;
● Equipped with an automatic wafer ring loading and unloading system, effectively improving production efficiency;
● Precision automation equipment effectively ensures that businesses improve production efficiency and reduce costs, thereby effectively enhancing their competitiveness.

Mainly used in flip-chip applications such as 0.5-meter flexible light strips

Cycle: 150ms

Product specification

Applications:

For LED packaging, screen display field, consumer electronics, smart home, intelligent lighting and other fields of high-precision & high-speed solidification equipment.

Applicable products: LED 2835,5050,21211010,0603,020, semiconductor and COB LED products such as solid crystal.

Established in 2008, Shenzhen Hongxinteng Technology Co., Ltd. is a leading manufacturer of Surface Mount Technology (SMT) machines, providing comprehensive solutions for the PCB and electronic manufacturing industries with competitive price supplier in China. We specialize in the design, production, and customization of full-line SMT equipment, supported by installation, software training, and exceptional after-sales service. Our commitment to innovation, quality, and customer satisfaction has made us a trusted partner for businesses worldwide.

We offer a complete range of SMT machines and solutions, including: SMT Pick and Place Machines, Solder Paste Printers, Reflow Oven Machines, 3D AOI (Automated Optical Inspection) Machines, 3D SPI (Solder Paste Inspection) Machines, Wave Soldering Machines, DIP Insertion Lines, THT Component Insertion Machine, UV Conformal Coating Machine, PCB Glue Dipensing Machine, UV Curing Furance Machine, BGA (Ball Grid Array) Machines, SMT Loader and Unloader Machines, Customized OEM and ODM Equipment.